How Does the “Die Size” of a Chip Impact Its Mining Efficiency and Cost?

The "die size" refers to the physical area of the integrated circuit on which the chip is fabricated. A smaller die size, often achieved through advanced semiconductor manufacturing processes, generally allows for more transistors in the same area or lower power consumption per transistor.

This translates to higher efficiency. However, smaller die sizes increase manufacturing complexity and cost, creating a trade-off between initial CapEx and long-term OpEx efficiency.